Embedded World Industry 4.0 Internet of Things

Embedded World 2017 – A Recap Of The Three Days In Nuremberg

Embedded World 2017

Embedded World 2017 in Nuremberg is over again. The three days at the exhibition centre in the Franconian metropole flew by so fast. Time to recap our presence at the leading international trade fair for embedded systems.

State-of-the-art technology in all facets of embedded technologies was presented by around 900 exhibitors from March 14-16. Future trends such as e-mobility, energy efficiency and the Internet of Things (IoT) were the hot topics discussed by the visitors from around the world. At our 200 square meter booth in hall 3A we had productive conversations under the motto “The EBV IoT – Bringing Your IoT Ideas To Life”.

embedded world ebv iot
The EBV IoT – Bringing Your IoT Ideas To Life

Together with our platinum sponsoring partners Broadcom, NXP, STMicroelectronics, Maxim Integrated and other gold sponsors we invited clients, partners and visitor to talk with us about the Internet of Things. The demos and exhibits at the supplier workstations were dedicated to support our customers and new prospects with their IoT and Industry 4.0 businesses and projects. Our technical specialists and field application engineers answered all kinds of questions about the latest product news, demos and ready-made solutions, we showcased during the exhibition.

The EBV Product Innovations Team presented our latest developments and solution from the EBVchips family. These semiconductor solutions, which are developed with and for our customers, fulfill special requirements that are not covered by products already available. They are designed in collaboration with our manufacturing partners and take on a variety of assignments needed to realize IoT applications.

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The EBV RF & Wireless team presented their broad portfolio

Furthermore, our RF & Wireless Team had a ton of products in their suitcases. Whether modules for Sub 1 GHz, IEEE802.15.4, Bluetooth, WiFi or GPS & GLONASS, our broad portfolio offers something for any kind of project.

A special highlight was presented by our Security & Identification segment. Together with Infineon Technologies and Data I/O we presented SentriX, a turnkey authentication solution. This service will enable high flexibility, cost-effectiveness, high security and customer specific certificates for smaller volumes and midsize customers.

Embedded World 2017 Security Identification
The EBV Security & Identification team presented a turnkey authentication solution

To put everything in a nutshell, we had a great and exciting time during in Nuremberg. What remains are plenty of inspirations for future projects and challenges. We hope you enjoyed the time with us at embedded world 2017 too! Have a safe trip home and see you next year!